2006, ISBN: 9783527326464
[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… Más…
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2006, ISBN: 9783527326464
[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… Más…
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2006, ISBN: 9783527326464
[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… Más…
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2012, ISBN: 3527326464
Gebundene Ausgabe Elektronik / Halbleiter, Halbleiter, Leitung (physikalisch) / Halbleiter, Materialwissenschaft, Nanotechnologie, Technologie / Nanotechnologie, mit Schutzumschlag 11, [… Más…
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ISBN: 9783527326464
hardback, [PU: Wiley-VCH, Weinheim]
| Blackwells.co.uk |
2006, ISBN: 9783527326464
[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… Más…
2006, ISBN: 9783527326464
[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… Más…
2006
ISBN: 9783527326464
[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… Más…
2012, ISBN: 3527326464
Gebundene Ausgabe Elektronik / Halbleiter, Halbleiter, Leitung (physikalisch) / Halbleiter, Materialwissenschaft, Nanotechnologie, Technologie / Nanotechnologie, mit Schutzumschlag 11, [… Más…
ISBN: 9783527326464
hardback, [PU: Wiley-VCH, Weinheim]
Datos bibliográficos del mejor libro coincidente
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Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.
This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Detalles del libro - Handbook of Wafer Bonding
EAN (ISBN-13): 9783527326464
ISBN (ISBN-10): 3527326464
Tapa dura
Año de publicación: 2012
Editorial: Wiley-VCH
395 Páginas
Peso: 0,937 kg
Idioma: Englisch
Libro en la base de datos desde 2008-09-14T15:42:19+02:00 (Madrid)
Página de detalles modificada por última vez el 2024-01-24T20:43:42+01:00 (Madrid)
ISBN/EAN: 9783527326464
ISBN - escritura alterna:
3-527-32646-4, 978-3-527-32646-4
Mode alterno de escritura y términos de búsqueda relacionados:
Autor del libro: ramm, peter james, peter troy, jia, jian, wiley vch verlag gmbh
Título del libro: bon, bonding, bond, handbook
Datos del la editorial
Autor: Peter Ramm; James Jian-Qiang Lu; Maaike M. V. Taklo
Título: Handbook of Wafer Bonding
Editorial: Wiley-VCH; Wiley-VCH
396 Páginas
Año de publicación: 2012-01-11
Impreso en
Peso: 0,924 kg
Idioma: Inglés
185,00 € (DE)
190,20 € (AT)
Available
170mm x 240mm x 26mm
BB; Hardcover, Softcover / Chemie/Sonstiges; Nanowissenschaften; Verstehen; Chemie; Components & Devices; Electrical & Electronics Engineering; Elektrotechnik u. Elektronik; Halbleiterphysik; Komponenten u. Bauelemente; MEMS; Mikrosystemtechnik; Nanomaterial; Nanomaterialien; Nanomaterials; Nanostrukturiertes Material; Nanotechnologie; Nanotechnology; Physics; Physik; Semiconductor Physics; Wafer; MEMS; Komponenten u. Bauelemente; Nanomaterialien; Halbleiterphysik; Nanotechnologie
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories - Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.Más, otros libros, que pueden ser muy parecidos a este:
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9783527644230 Handbook of Wafer Bonding (Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo)
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