Etching performance of silicon wafers with redesigned etching drum - libro nuevo
ISBN: 9783847344179
Etching process involves various chemical reactions and reflects significantly on silicon wafer quality. Design of Experiments (DOE) with full factorial design is employed for optimizatio… Más…
Etching process involves various chemical reactions and reflects significantly on silicon wafer quality. Design of Experiments (DOE) with full factorial design is employed for optimization purpose. Etching factors namely the bubbling flow rate, wafer rotation, and etchant temperature had been randomized with additional three center points to observe any curvature. The responses studied are etching removal, total thickness variation (TTV) and wafer brightness. Additionally, the etchant temperature and bubbling flow rate provide interaction effect on both etching removal and wafer brightness. A higher bubbling flow rate is required to ensure etching removal and brightness within specification. Besides studying these three responses, the wafer surface after etching is analyzed using ADE Infotool software which captures the etched surface profile and its thickness. Finally, the removal uniformity throughout the redesigned etching drum is observed. Etching performance is enhanced with the optimized value of bubbling flow rate, etchant temperature and wafer rotation to achieve the optimum etching removal distribution. Bücher, Hörbücher & Kalender / Bücher / Sachbuch / Herstellung & Technik / Herstellungs- & Verfahrenstechnik<
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Hamidon Musa Rozzeta Dolah: Etching Performance of Silicon Wafers with Redesigned Etching Drum An Approach to Etching Optimization - libro nuevo
ISBN: 9783847344179
Etching Performance of Silicon Wafers with Redesigned Etching Drum An Approach to Etching Optimization Author :Hamidon Musa Rozzeta Dolah 9783847344179 384734417X
Etching performance of silicon wafers with redesigned etching drum - libro nuevo
ISBN: 9783847344179
Etching process involves various chemical reactions and reflects significantly on silicon wafer quality. Design of Experiments (DOE) with full factorial design is employed for optimizatio… Más…
Etching process involves various chemical reactions and reflects significantly on silicon wafer quality. Design of Experiments (DOE) with full factorial design is employed for optimization purpose. Etching factors namely the bubbling flow rate, wafer rotation, and etchant temperature had been randomized with additional three center points to observe any curvature. The responses studied are etching removal, total thickness variation (TTV) and wafer brightness. Additionally, the etchant temperature and bubbling flow rate provide interaction effect on both etching removal and wafer brightness. A higher bubbling flow rate is required to ensure etching removal and brightness within specification. Besides studying these three responses, the wafer surface after etching is analyzed using ADE Infotool software which captures the etched surface profile and its thickness. Finally, the removal uniformity throughout the redesigned etching drum is observed. Etching performance is enhanced with the optimized value of bubbling flow rate, etchant temperature and wafer rotation to achieve the optimum etching removal distribution. Bücher, Hörbücher & Kalender / Bücher / Sachbuch / Herstellung & Technik / Herstellungs- & Verfahrenstechnik<
Nr. BM8GTBDSN22. Gastos de envío:, Lieferzeit: 5 Tage, DE. (EUR 0.00)
Hamidon Musa Rozzeta Dolah: Etching Performance of Silicon Wafers with Redesigned Etching Drum An Approach to Etching Optimization - libro nuevo
ISBN: 9783847344179
Etching Performance of Silicon Wafers with Redesigned Etching Drum An Approach to Etching Optimization Author :Hamidon Musa Rozzeta Dolah 9783847344179 384734417X
1Dado que algunas plataformas no nos comunican las condiciones de envío y éstas pueden depender del país de entrega, del precio de compra, del peso y tamaño del artículo, de una posible membresía a la plataforma, de una entrega directa por parte de la plataforma o a través de un tercero (Marketplace), etc., es posible que los gastos de envío indicados por eurolibro/terralibro no concuerden con los de la plataforma ofertante.
Detalles del libro - Etching performance of silicon wafers with redesigned etching drum
EAN (ISBN-13): 9783847344179 ISBN (ISBN-10): 384734417X Tapa dura Tapa blanda Año de publicación: 2012 Editorial: AV Akademikerverlag GmbH & Co. KG.
Libro en la base de datos desde 2009-06-01T15:52:31+02:00 (Madrid) Página de detalles modificada por última vez el 2022-07-25T17:26:41+02:00 (Madrid) ISBN/EAN: 9783847344179
ISBN - escritura alterna: 3-8473-4417-X, 978-3-8473-4417-9 Mode alterno de escritura y términos de búsqueda relacionados: Título del libro: silicon, performance, drum
